Adhesive specialist Techsil has launched a new potting compound with medium viscosity and small filler particle size: Structalit® 5894-1 is the perfect choice for large-volume potting or glob top sealing of power electronics.
Structalit® 5894-1 is a one-component, black epoxy resin from manufactures Panacol. During application it features optimum flow properties, due to its combination of optimized viscosity and small particle size of fillers. As an additional benefit, the low filler weight makes Structalit® 5894-1 less abrasive during application.
Structalit® 5894-1 cures rapidly when exposed to heat, which allows faster processing of large-volume electronic component potting and sealing. Once cured, the compound provides a smooth and level surface which is at the same time shock- and scratch-resistant.
For further information please contact our Technical specialists at technical@techsil.co.uk
Find more out about our industry solutions for potting and sealing compounds from https://www.techsil.co.uk/products/resins-compounds
About Techsil
Techsil is a global supplier of industrial RTV silicones, adhesives, sealants, encapsulants, conformal coatings, tapes and dispensing equipment to a wide range of manufacturing industries including Aerospace, Automotive, Medical, Electronics and LED Lighting. Techsil is the authorised UK distributor for Panacol http://www.techsil.co.uk/
