A significant portion of budgets includes energy consumption for IT equipment and server cooling. nVent offers a comprehensive range of standard and customized air, indirect and direct water cooling solutions. Our product range enables you to meet these challenges and protect your IT assets, whether for smaller decentralized edge computing, harsh environments, or large data center installations.
The rapid emergence of Big Data, 5G, Industry 4.0 and IoT deployments also require protection for edge-computing applications, such as high-speed wireless, autonomous vehicles, industrial automation, transportation, security and safety systems. These complex systems are powered by smaller and faster electronics that require effective cooling protection to ensure maximum operating performance and uptime.
Legacy cooling in data centers uses technology based on traditional air conditioning systems. Entire rooms, sometimes complete buildings, are cooled with a single system. These Computer Room Air Conditioning units (CRAC) or Computer Room Air Handler (CRAH) worked well for a number of years, while IT cabinets were not densely packed, and less heat was generated in a given space. While still popular today, whole room cooling can be inefficient and expensive. Increasing the rack density also requires more air volume to take away the heat.
Containment systems can help to separate the exhaust air from the cooled air and optimize air flow. Nevertheless, at one point the air volume required because high energy cost to overcome pressure drops in ducts and raised floors. In addition, there will be thermal losses.
Air-to-water heat exchangers positioned near the electronics have now become a preferred method of cooling for data centers. They can be used to respond quickly to increasing temperatures generated by the higher packaging densities of the electronics.
Overcoming the challenge of optimized operating costs and availability the best way is to design you cooling system following the installed heat load. Moving from room based cooling to rack row or even rack based designs allows the operator to implement higher loads.
nVent makes use of its years of experience in the application of integrated air-to-water heat exchangers to improve and further develop products in the area of electronics cooling. The existing air-to-water heat exchanger series for cabinet and cabinet row cooling has been expanded with the rear door cooler with a cooling capacity of up to 55 kW.
nVent SCHROFF RackChiller Rear Door Chilled Water Heat Exchanger is designed for managing high heat load cooling requirements within higher-density server, computing and storage racks. The entire system is integrated within an aesthetically framed perforated door with protective covers to isolate the liquid source and cooling loop from the rack-mounted equipment. The Rear Door Cooler installs on equipment racks as a separate complete rear door, enabling it to be retrofitted to existing racks. nVent SCHROFF Rear Door Chilled Water Heat Exchanger cools the warm exhaust air generated by the fans in the existing rack-mounted IT equipment through a large cooling coil surface before reintroducing back to the room.
For even more demanding HPC (High Performance Computing) installations, it can be necessary to even move to chip based cooling. There are already several servers with integrated cold plates available, while not 100% of the heat can be transferred over the liquid circuit and air as a cooling medium is still needed. The combination of direct to chip cooling distribution units and rear door cooler help to address HPC loads of up to 80 kW on a single rack.
