BIRMINGHAM, UK, 9 April 2025 – ByteSnap Design, a leading UK electronics design consultancy, today announced the release of Futureproofing Manufacturing: Tackling Obsolescence & Electronics Challenges in Industrial Manufacturing.

Based on extensive research with nearly 600 industry professionals, the report offers strategic insights and practical frameworks for tackling obsolescence in embedded electronics, components, and software systems.

Conducted between February and March 2025, the research is released to coincide with World IoT Day on 9 April, acknowledging the increasing role Industrial IoT (IIoT) plays in adding complexity—and urgency—to obsolescence challenges across the manufacturing sector. The findings reveal a critical disconnect in the UK manufacturing ecosystem: while 88% of manufacturers recognise the need for specialised electronics expertise to manage obsolescence, 81% report difficulty in finding reliable partners with the right capabilities.

“Our research uncovered that technological obsolescence has evolved from an occasional operational hiccup into a persistent strategic challenge for UK manufacturers,” said Dunstan Power, Director at ByteSnap Design and author of the whitepaper. “What’s particularly striking is the electronics expertise gap. Despite strong demand for knowledge in component lifecycle management and embedded systems, many firms are left without adequate support. This bottleneck could delay product innovation and compromise long-term competitiveness.

“Those who invest in robust obsolescence management now will be best placed to harness emerging technologies like AI – often deployed alongside IIoT systems – for greater efficiency, system insight, and resilience.”

Key findings from the report include:

  • 88 per cent of manufacturers encounter technological obsolescence at least annually, with 27 per cent facing these challenges quarterly. Redesign costs following component discontinuation can exceed £250,000 in complex systems.
  • Proactive management reduces costs by up to 80 per cent compared to reactive approaches. Manufacturers adopting structured strategies are better able to maintain continuity and avoid last-minute design compromises.
  • 89 per cent of respondents consider AI integration important for future competitiveness.AI, often in tandem with connected hardware platforms, enables predictive maintenance, lifecycle forecasting, and quality control across electronics-heavy environments.
  • 61 per cent cite cost constraints as their main barrier to technology adoption.The report explores the tension between modernising legacy electronic systems—through IoT, automation, or redesign—and the realities of constrained capital budgets.
  • 72 per cent of manufacturers express a need for upskilling and training programmes.This demand is especially acute in advanced electronics, embedded systems, and AI—fields where knowledge gaps pose significant risks as experienced engineers retire.

The report also highlights the wider ripple effect of obsolescence on connected systems. When a key component or module becomes unavailable, it can render entire product lines unsupportable — disrupting production schedules, affecting time-to-market, weakening supply chain reliability, and even compromising regulatory compliance in sectors like medical and energy.

The report provides manufacturing leaders with a structured approach to obsolescence management, including a readiness assessment framework, implementation roadmap, and strategies for long-term resilience. These tools are designed to help manufacturers—particularly those with electronics-intensive systems—transition from reactive fixes to proactive, lifecycle-aware planning.

Download the full report: https://www.bytesnap.com/futureproof-product-development-report/