Electronics are getting smaller, and so are their components. Inspecting microcircuits, semiconductor wafers, and other electronics is challenging because even a small piece of debris can cause a malfunction.
Manufacturers use microscopes with high-quality optics to inspect soldered connections in circuits, the condition of wires in printed circuit boards, and to look for contaminants. In some applications, the roughness of the components used in a device is measured using noncontact laser confocal microscopes to ensure they meet strict standards.
At Olympus there are 3 categories for microscope solutions in the field of electronics, which we would like to present to you in detail.
This section deals with the correct use of microscopes in semiconductor production for a wide range of different procedures and industries.
There are detailed information and articles on various topics, such as IC design, wire bonding, photolithography, dicing, testing and other relevant topics used in semiconductor applications.
With the DSX1000 digital microscope we offer an easy to use system for the observation of sub-micrometer patterns. In addition, the OLS5000 laser confocal microscope can analyze surface roughness conditions after polishing.
In the PCB (Printed Circuit Board) category we focus on the important points for microscopic solutions within the manufacturing processes.
Here we have gathered information about the use of the microscope in the processing of the inner and outer layer, in the assembly of electronic components on surfaces, in the placing of solder resist and more important applications.
It provides interesting insights into the use of the DSX1000 supporting quality checks of through holes, via holes, copper patterns, and more. Furthermore, our BX series metallurgical microscope can observe the residues of flux that sometimes remain after soldering.
Also, we offer reliable data about microscope usage in Lithium-Ion battery production processing.
On this page the topics of the microscopy set in the areas electrode process, assembly process and inspection are covered.
We provide a variety of solutions for measuring surface roughness, cross sections, and hole diameters. The DSX1000 digital microscope supports quality control of contamination and burr.